Cementation of Copper with Zinc from Dilute Aqueous Solutions

A rotating disc geometry was used to provide a uniformly accessible surface for a kinetic study of copper cementation with zinc in sulphate solution. For copper concentrations of the order of 10 p.p.m., a porous, adherent deposit is formed on the zinc surface and this has a significant influence on the reaction rate. When the specific mass of deposit is less than about O· 35 mg/cm2 the surface may be considered as smooth and the rate is described by simple convective counter diffusion of zinc and copper ions through a laminar diffusion boundary layer to the deposit-solution interface. In the presence of additional deposit, the diffusional mass transfer rate is increased by increased surface roughness.The rate under these conditions is first order, with the degree of enhancement independent of further increases in the specific deposit mass. The enhancement in rateis, however, directly related to the initial mass flux and the species involved in the reaction.Preliminary work showed the same mechanism to apply to cementation from chloride solution, solutions of high zinc concentration, and cementation of copper with iron..