Characterizing the Role of Organic Additives in Copper Electrowinning

Additives are commonly used in copper electrowinning to improve cathode morphology. Polysaccharides such as guar are generally favoured as additives due to their compatibility with solvent extraction. Polyacrylamides are, however, being considered as possible alternatives. Understanding the influence of the structural chemistry of additives on electrowinning performance is critical to utilise them efficiently. This paper investigated polyacrylamide additives which are structurally different; their effects on copper electrodeposition were characterized and compared to that of guar. Electrochemical impedance spectroscopy (EIS) were used to characterize the effects of molecular weight and ionic charge of the polyacrylamides on electrodeposition. The findings were compared against results obtained with an industrially used guar product. Equivalent circuit modelling of EIS data indicated that an increase in polyacrylamide concentration and a decrease in additive molecular weight increased the overall system resistance.