Codeposition Behavior Of Impurities In Copper Electrowinning From Cuprous Chloride Solution

The codeposition behavior of impurities such as Ag, Bi, Fe, Ni, Pb and Sb with Cu was investigated galvanostatically at 5-3000 A/m2 using a Pt cathode at 60 °C in acidic copper (I) chloride (cuprous chloride) solution at pH1-2 containing 1.0 mol/L of Cu+ and 4.9 mol/L of Cl-. The impurities were classified into two groups: Group I (Ag, Bi) which codeposits with Cu as a metal, and Group II (Fe, Ni, Pb, Sb) which is slightly involved in the deposited Cu in nonmetal form from the electrolyte. Silver and Bi in Group I behaved as more noble metals than Cu, and significantly codeposited with Cu, showing typical features of regular-type codeposition. When Cu was deposited dendritically, the Ag and Bi content in the deposit increased with increased duration of electrolysis as a result of decreased net current density caused by increased cathode area. The current efficiency for Cu deposition in impurity-free solution was 95-100% over 100-1000 A/m2, but it abruptly decreased at above 1000 A/m2 when the limiting current density of Cu was attained. Although Fe, Ni, Pb and Sb in Group II were involved to 0.01-0.02 mass% in the deposit, they had no influence on the current efficiency or morphology of Cu.