Copper Alloy Systems with Variable Alpha Range and Their Use in the Hardening of Copper

1. In addition to the alloys of copper with iron previously found by Hanson and Ford to show an increase in the concentration of the alpha range with increase in temperature the following binary and ternary systems have been found by the author to exhibit: the same feature: (a) Copper-chromium. (b) Copper-cobalt. (c) Copper-silicon. (d) Copper-nickel-silicon and its pseudo-binary section Cu-Ni2Si (formula of compound definitely established). (e) Copper-cobalt-silicon and its pseudo-binary section Cu-Co2Si (formula of compound established with some probability but not as definitely as for Ni2Si). (f) Copper-chromium-silicon; formation of a compound definitely established (compare Figs. 1 and 2). The formula of this compound may be either Cr2Si or Cr3Si. (g) Copper-iron-silicon; presence of a phase containing both iron and silicon established in an indirect way only. No definite microconstituents observed. 2. RANGES OF SOLID SOLUBILITY (percentage at various tempera¬tures). (a) For copper-chromium: 0.8 at 1000° C.; 0.5 at 900° C.; 0.25 at 800° C.; 0.05 to 0.1 at 500° C. (b) For copper-cobalt: 3.4 at 1000'C.; 2.4 at 900'C.; 1.7 at 800'C.; 0.9 at 600°C.; 0.35 at room temperature. (c) For copper-silicon (Fig. 3) : 6.8 ± 0.1. per cent. at 800° C.; 3 per cent. at 400° C. and probably below 2 per cent. at room temperature if sufficiently long annealed. (d) For copper-cobalt silicide: 3.3 at 1000° C.; 2.4 at 900° C.; 1.6 at 800° C.; 0.7 at 600° C.; 0.3 at 300° C. (e) For copper-nickel silicide (Fig. 4): 8.2 at 1000° C.; 5.5 at 900° C.; 3.6 at 800° C.; 1.6 at 600° C.; 0.7 at 300° C.