Copper and Tantalum Recovery from Printed Circuit Board

Printed circuit boards (PCBs) from discarded personal computer (PC) and household appliances were crushed by mechanical crushing or water explosion to remove mounted parts. More parts were stripped from PCB for PC composed of epoxy resin than from PCB for household appliance composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 1073K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. On the other hand, tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins by heat treatment at 723 to 773K in air atmosphere and screening of 0.5mm. Silica was removed and 70% of tantalum grade was obtained after more than 823K heating and separation.