Development Of High-Performance Copper Alloy Wire "Eftec-194w"

Recently, electronic devices have become smaller for some kinds of electronic devices, thermal dissipation and electrical conductivity of conventional Fe based alloy becomes insufficient. We selected the Cu-Fe based alloy CDA19400 and optimized the wire manufacturing process. Precipitates during aging treatment were observed by TEM. The size and distribution of the precipitates varied according to solution treatment temperature. With solution treatment at 950°C, the precipitates of y-Fe as fine as 10 nm were distributed dense in the copper matrix with coherency. For the solution treatment at 750°C, y-Fe of approximately 200 nm was observed. Comparing heat resistance of drawn wires, the material at 950°C treatment was superior. Electrical conductivity decreased from 63% IACS upon aging to 29% IACS by drawing. It is considered as particular phenomena for wires where materials are drawn with high reduction ratio. By the optimized manufacturing process, we successfully developed a new wire that has superior in strength, thermal conductivity, electrical conductivity, heat resistance and repeated bendability.