Examination of Selected Copper Electrowinning Additives

Some commercial copper electrowinning facilities use Cyquest N-900 (a polyacrylamide) or HydroStar (a modified polysaccharide) to improve the density and smoothness of copper electrodeposits. However, the effects of these additives have not been studied extensively in the open literature. Thus, the electrodeposition of copper at 40 oC from a non-stirred synthetic electrowinning electrolyte (40 g/L Cu2+, 160 g/L H2SO4, and 20 mg/L Cl-) in the presence of various concentrations of either additive was evaluated using cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS). CV results show that neither additive has much effect on the nucleation overpotential of copper electrodeposition on stainless steel. However, Cyquest N-900 polarized the copper deposition reaction upon the return sweep. The EIS data indicates that Cyquest N-900 increases the reaction’s charge transfer resistance and creates a second low frequency loop. HydroStar had minimal effect on the electrochemical data generated by CV or EIS. Thus, the mechanism by which HydroStar affects the copper deposition reaction still needs to be determined.