Formation of Al-Cr-N Films by a DC Reactive Sputtering Method and Evaluation of Their Properties

The Minerals, Metals and Materials Society
Y. Ide K. Kishitake
Organization:
The Minerals, Metals and Materials Society
Pages:
6
File Size:
320 KB
Publication Date:
Jan 1, 2000

Abstract

It is expected that an Al-Cr-N composite nitride film may have a higher resistance to oxidation at elevated temperatures than the well-known Ti-Al-N films. The formation conditions of Al-Cr-N films by a de reactive sputtering method and their properties were studied in this study. The films characterized with respect to their high temperature properties such as chemical composition, crystal structure, microhardness, wear and· friction. The crystal structure of the Al-Cr-N films changed from hexagonal phase to cubic phase with an increase in Cr content in the films. The resistivity to thermal oxidation of the Al-Cr-N films is superior to that of usual TI-Al-N films. A half of the friction coefficient in the Al-Cr-N film was obtained comparing with that in the ordinary TI-Al-N film at room temperature and the wear rate of Al-Cr-N film was 2 order smaller than that of TI-Al-N film. The Al-Cr-N films show a small friction coefficient at 500°C and then they are recognized to have good tribological characteristics.
Citation

APA: Y. Ide K. Kishitake  (2000)  Formation of Al-Cr-N Films by a DC Reactive Sputtering Method and Evaluation of Their Properties

MLA: Y. Ide K. Kishitake Formation of Al-Cr-N Films by a DC Reactive Sputtering Method and Evaluation of Their Properties. The Minerals, Metals and Materials Society, 2000.

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