GMSG Guideline: Determining the Bond Efficiency of Industrial Grinding Circuits

"Use of the Bond Work Index to size industrial grinding equipment was widely known. Bond also described its application for measuring grinding circuit efficiency. Bond Work Index efficiency has been widely used by industry, but until now without concise standard methods, or a formal guideline, for doing so. The Bond Efficiency Sub-Committee of the Industrial Comminution Efficiency work group of GMSG has produced such a guideline, which follows. It covers the methods and provides examples of how to calculate the Bond Work Index Efficiency of most industrial grinding circuits. Bond Work Index testing equipment and methods are also provided. The next steps are: (1) to establish standard reference testing materials and one or more laboratories to serve as bases for reference testing; (2) to establish the accuracy of relative circuit Work Index Efficiency determinations; and (3), to develop and provide a public data base of industrial comminution circuit Bond Work Index Efficiencies. OUTLINE Introduction and Background Part 1. Determining the Bond Efficiency of a Grinding Circuit Method Demonstration/Example Calculations Bond Work Index Testing Equipment and Procedures Accuracy of Comparative Circuit WI Efficiency Determinations (under development) List of Symbols Part 2. Data Base of Bond Grinding Circuit Efficiencies (under development) References Annexes: A1. The Bond Crushing WI Test Equipment and Procedure for Bond Efficiency Determinations (Revised March 26, 2015) B1. The Bond Rod Mill WI Test Equipment and Procedure (Revised March 26, 2015) C1. The Bond Ball Mill WI Test Equipment and Procedure (Revised March 26, 2015) Introduction and Background Please see the references and slide presentation “Bond Efficiency SLC (rev3)-print.pdf.” This efficiency determination applies to most brittle materials in their naturally occurring (un-scalped) size distributions being treated in size reduction circuits down to a product sizing of approximately eighty percent passing 70 µm (see below). Unusually shaped materials (e.g. mica) should be regarded with caution. Part 1. Determining the Bond Efficiency of a Grinding Circuit Method In the plant: • Define the circuit for which the WI efficiency is to be determined • Procure samples of the circuit feed and product • Obtain the power draw of the size reduction equipment at the drive pinion(s) • Obtain the circuit throughput rate (dry tonnage) In the laboratory:"