Institute of Metals Division - Effect of Prior Strain at Low Temperatures on the Properties of Some Close-Packed Metals at Room Temperature

WHEN metallic materials are deformed plastically, the process may be considered as one in which hardening and recovery occur simultaneously. The net hardening is that produced by deformation in the absence of recovery lessened by recovery during and immediately following deformation. Strain hardening takes place through movements of large groups of atoms acting to a degree as an entity. A complex microstress system is developed. Recovery is a diffusive-type process involving single atoms or, at most, only a few atoms in concerted action. This is accompanied by elastic strain relaxation. Recovery is strongly temperature-dependent. The driving energy for the process resides in thermal fluctuations of the atoms augmented by the energy of the stress field producing the deformation, and by that produced by the deformation. At very low temperatures recovery is essentially absent, or very small. At high temperatures in the hot working range, recovery is so rapid that deformation results in no appreciable net hardening. The interplay of strain-hardening and recovery results in differing end structures depending on the temperature and the strain rate of the process. For example, there is a prominent difference in the spacing of the slip markings and in the detail of X-ray diffraction patterns. High temperatures and slow strain rates favor a wide spacing of slip markings and sharp reflections.',' This suggests that change in rate of the recovery concurrent with deformation modifies to a degree the manner of the deformation. Different slip systems may operate. For very slow rates, the mechanism may, as has been suggested, differ from that of "classical slip." In the experimental work that follows the findings will be interpreted from the point of view developed in this section. Recovery and Electrical Conductivity Electrical conductivity is a sensitive indicator of the state of strain in a material3' * and was used in this investigation. The materials studied in wire form were: OFHC copper, a high purity (99.99 pct) and 2s grade aluminum, and grade A nickel. Wire annealed and initially 0.050 in. in diam was drawn through diamond dies in a simple holder maintained at 25", —75°, or — 195°C. Precautions were taken that for each material all conditions of drawing were the same except the temperature. Electrical resistivity was measured for each condition at 20°C. This was done as soon as practical after drawing to minimize possible room temperature recovery. The data for the four materials are plotted in Fig. 1 in terms of the change in resistivity for drawing at the several temperatures. The effect of temperature of drawing on the increase in resistivity is most pronounced for copper. Drawing at 25°C to 80 pct reduction in area increases the resistivity approximately 2 pct; drawing at —195°C to the same reduction increases the resistivity about 6 pct. The increase in resistivity" & in this metal is due to extra scattering of conduction electrons originating in the lack of orderly arrangement of the atoms induced by the deformation process. It has been suggested