Institute of Metals Division - On the Nature of Strain Hardening in Fcc Metals

The low -temperature tensile and creep behaviors of single crystals of copper were evaluated and analyzed in such a manner as to provide an estimate of the separate contributions of short-and long-range stress fields to strain-hardening. Furthermore, the average force-displacement diagram for thermally activated intep-section of two dislocations was estublished. This diagram plus a knowledge of the variation of dislocation spacing and the long-range back stresses with strain permits on accurate prediction of creep rates. The calculated activation energy for intersection under conditions of a constant strain rate increases linearly with the absolute tempevatus-e as required by theory. AN understanding of the detailed mechanisms for strain hardening constitutes one of the principal unsolved problems in dislocation theory. Two major models for strain hardening have been advanced in the past. The one that has received greatest attention assumes that strain hardening arises exclusively from long range interaction stresses between moving dislocations and piled-up arrays of blocked dislocations on the slip planes. This type of interaction was first announced by Taylor' who revealed that the back stress fields due to a simple uniform array of positive and negative dislocations entrapped in the deformed crystal would result in parabolic hardening. Shortly thereafter Andrade and Henderson" demonstrated that the strain hardening of fcc single crystals was not parabolic, as previously thought, and finally it was recognized that a typical stress-strain curve consisted of three successive stages of deformation, niz., the easy glide, Stage I, linear hardening, Stage 11, and the parabolic hardening, Stage 111, ranges. The objections to Taylor's somewhat na'ive model, which were presented so forcefully by cottrell; were largely removed by the more realistic details incorporated in Mott's analysis.5 But because Mott's theory for hardening via long range stress fields gave somewhat analogous results to that of Taylor's (inasmuch as it also predicted a parabolic rate of strain hardening whereas the observed rate of strain hardening in Stages I and I1 were linear), it was not widely accepted. Major consideration was therefore given to models, such as those which were advanced by Friedel and seegere that were formulated for the ad hoc purpose of yielding linear rates of strain hardening. The second major thought regarding strain hardening is based on the concept that it arises principally from short-range stress fields due to the interactions between intersecting dislocations. Cottrell and stokes7 showed, several years ago, that the constancy of the flow stress ratio at two temperatures regardless of the strain was inconsistent with the concept that strain hardening arose exclusively from long-range back stresses. The argument that strain hardening was primarily due to local interactions of intersecting dislocations was presented in considerable detail by asinski.' Extending Basinski's method of analysis of the intersection process, Mitra, Os-borne, and dorn recently demonstrated that indeed the strain hardening in aluminum single crystals arises principally from local effects coincident with intersection; however, these conclusions, too, must be modified, as will be shown later in this report. The present investigation, devoted principally to the low-temperature deformation of copper single crystals, was initiated in an attempt to ascertain whether or not the same conclusions arrived at for aluminum also apply to metals, such as copper, which have much wider stacking faults. It was soon observed that the strain hardening in copper could not be attributed exclusively to local effects between intersecting dislocations. Previously no analytical method for arriving at the possible simultaneous contributions of long-range stress fields and localized forces on intersecting dislocations was available; consequently, the separation of these two factors could not be readily accomplished. In the present report a method of estimating the separate contributions of each of these two factors to strain-hardening will be presented. The authors will show that both long-range stress fields of the type contemplated by Seeger and Friedel as well as short-range forces of the type considered by Basinski are responsible for strain hardening in fcc metals at low temperatures. This method of analysis also accounts for, in a satisfactory way, the effect of stress, temperature, and strain on the creep rate under constant stress. Furthermore, in the course of presenting their methods of analysis the authors will also reveal the rather complete agreement of their experimental data with the concepts of the theory for thermally activated intersection of dislocations. INTERSECTION MODEL As shown by seegerl0 the strain rate arising from thermally activated intersection of dislocations is given by