Institute of Metals Division - Recovery of Creep-Resistant Substructures

The object of this investigation was to analyze the recovery that arises when the stress on a specimen undertaking creep is reduced. For this purpose annealed specimens of high-purity aluminum were precrept under a stress of 1000 bsi to a strain of 0.08 following which the stress was reduced for various periods of time to 10, 250, 500, or 700 psi. When the original stress was reapplied the subsequent creep curve lay above that for the unre-covered state and below that for the original annealed state. Analyses on the kinetics of this recovery as a function of the temperature gave a stress-sensitive activation energy that decreased as the reduced stress was increased from a value of 64,000 cal per mole at 10 psi to 37,000 cal per mole at 750 psi. Recovery was also detected and measured during creep under the reduced stress. Following a short initial period, the creep rate under the reduced stress increased monotonically until it reached the secondary-creep rate for the reduced stress. The temperature dependence of this phenomenon was also shown to be correlatable in terms of the previously deduced activation energy for recovery. The activation energies for creep of most pure metals at high temperatures have been shown to agree well with those for self-diffusion.'j2 Since the true secondary stage of creep is usually due to the steady-state balance between the rate of strain hardening and the rate of recovery, it is generally thought that the activation energy for recovery of the creep-induced substructure equals that for creep itself. A shoft time ago, however, Ludemann, Shepard, and Dorn~ found that the activation energy for recovery of the creep-induced substructure in high-purity aluminum under zero stress was almost twice that for self-diffusion, namely about 65,000 cal per mole; obviously recovery under reduced stresses differs in some significant way from the recovery that accompanies the secondary stage of creep. The major purpose of this investigation is to study the effect of stress on the re- covery of the creep-induced substructure in order to provide a better understanding of the recovery mechanism itself. EXPERIMENTAL TECHNIQUE High purity aluminum, containing 0.004 pct Cu, 0.002 pct Fe, and 0.001 pct Si, used in this investigation, was in the form of 0.100-in.-thick sheet which has been cold-rolled to the H-18 temper. Creep specimens were milled from the sheet with their tensile axes in the rolling direction. All specimens were then heated at 686°K for 1 hr followed by air cooling in order to produce an annealed structure which exhibited a uniform equiaxed grain size of about 4 grains per mm. Tests were run in creep machines fitted with Andrade-Chalmers type of lever arms so contoured as to maintain the stress constant to within 0.05 pct of the reported values. Constant temperatures to *O.l°K were obtained by complete immersion of each specimen in a temperature-controlled and agitated bath of molten KN02-KNOs mixture. Where changes in temperature were involved, the change was effected in less than 2 min by manually replacing one bath by another controlled at the second temperature. Displacements over the gage section were sensed by linear differential transformers, the output of which was autographically recorded. The calculated strain measurements were sensitive to 5x EXPERIMENTAL PROCEDURE The following analyses are based on extensions of the previously announced effect of the temperature on the creep strain,2 namely for a = constant, where e = the total true tensile creep strain for a given applied true tensile stress, t = the duration of the test, R = the gas constant, T = the absolute temperature, Q, = the activation energy per mole for creep which is independent of the stress, / = a function of 8, = and of the stress, and a = the stress. The validity of this correlation for high-purity aluminum is demonstrated in Fig. 1 for temperatures in the near vicinity of 600°K; the activation energy for creep, Q,, which is approximately that for self-diffusion, is insensitive to the applied stress