Institute of Metals Division - Some Comments on Strain-Gage Techniques for Determining Microstrain (TN)

ThE use of strain gages in the measurement of microplastic behavior of materials is well-known.'-3 Recently it has been suggested that similar techniques might be useful for determining stress relaation. It is the purpose of this report to comment on the use of strain gages in the measurement of strains in the vicinity of 10"6. We will also discuss observations of an anomalous anelastic behavior apparently associated with small temperature changes, which accompanies the unload portion of a load-unload microstrain test. The key to successful strain determinations at levels below 1 pin. per in. is a good gage-mounting technique and either precise ambient temperature control or a set of matched temperature-compensated gages. The importance of good mounting cannot be overemphasized, for example, as in the use of Eastman 910 contact cement. If the cement layer is not sufficiently thin and properly hardened, it is possible to observe anomalous negative stresses when small loads are removed, which relax back to zero in an orderly way with time. Such anomalous behavior, thought to be due to gage bonding, has been reported in microstrain experiments by Thomas and verbach' who observed a negative strain of -3 X lo-' upon unloading. This kind of behavior severely limits the over-all strain sensitivity which can be achieved in such tests. The relaxation of a small positive strain subsequent to unloading in a load-unload experiment is quite normal, however, and is to be expected. The occurrence of an apparent negative strain is also encountered in those instances where the elasticity of the bonding cement is exceeded—for example 0.5 pct or 5000 pin. for cured Eastman 910. An elastic strain of this magnitude can be encountered during load-unload type testing particularly in higher-strength materials (-150,000 yield strength). During the course of microplasticity studies on pure nickel and nickel alloys,' the authors have made the following observation. In a four-point bending test, two active gages are mounted one on each side of the beam as arms R1 and R z of a conventional strain-gage bridge circuit shown in Fig. l(a). This technique provides two advantages: the sensitivity is doubled because R1 and Rz experience opposite strains and temperature compensation is provided automatically because any ambient temperature change would cause both gages to see a strain of like sign whose signals would cancel in the circuit.