Institute of Metals Division - Substructure Formation During High-Temperature Creep of (110) [001]-Oriented Polycrystalline Fe-3.1 Pct Si

The types of substructures developed during high-temperature creep of (110)[001]-oriented polycrys-talline Fe-3.1 pct Si were examined by electroetching of dislocation sites. Edge dislocations were observed to accumulate adjacent to grain boundaries and poly-gonize perpendicular to their glide planes to form a "Pile-up" of nearly parallel tilt boundaries. The dislocation density developed within the grains during steady-state creep was found to increase with increasing stress. The formation of periodically spaced groups of edge dislocations along grain boundaries was observed, and it was proposed that these formed to relive bending stresses at grain boundary shear .faults. Grain boundary serrations developed at these faults, and it was suggested that this was a result of localized grain boundary migration at the polygonized groups. THE authors have conducted a series of high-temperature creep tests on (110)[001]-oriented poly-crystalline Fe-3.1 pct Si sheet. The creep specimens were examined at various stages of creep by means of electrolytic etching of dislocation sites using the chrome-acetic acid solution developed by Morris.' Hibbard and Dunn2 have demonstrated that the etch pits produced with this technique correspond to single dislocations. It is the purpose of this paper to present and discuss the dislocation substructures which were formed during high-temperature creep at constant stress. EXPERIMENTAL PROCEDURES The polycrystalline Fe-3.1 pct Si sheet employed in this study contained a (110)[001] texture. This texture was quite strong, and the elastic properties of the sheet closely approached those of a single crystal of iron.3,4 A typical analysis in weight percent for this material is 3.1 Si, 0.1 Mn, 0.003 C,