Institute of Metals Division - The Effect of Grain Boundary Migration on the Formation of Intercrystalline Voids During Creep

RECENTLY Chen and Machlin' proposed a mechanism for intercrystalline cracking in metals during high-temperature stressing. According to this mechanism the formation of voids at grain boundaries is primarily responsible for intercrystalline cracking. A model has been provided to demonstrate the initiation of submicroscopic cracks and voids at jogs of grain boundaries where grain boundary sliding is inhibited. Submicroscopic cracks can grow as a result of either further grain boundary sliding or localized tensile stress. In the former case, it is believed that grain boundary sliding produces more voids which link together to produce macroscopic cracks and which may lead to the eventual failure of the metal. Concurrently, Nield and Quarrell2 reported their interesting results obtained in a systematic investigation of intercrystalline cracking in two aluminum alloys under various creep conditions. Their observations are generally in agreement with the above mechanism, especially the conclusion that voids are formed as a direct consequence of grain boundary sliding. On the basis of the volume fraction occupied by voids, they could find no confirmation of vacancy condensation as the mechanism for void growth. Furthermore, an important feature of intercrystalline cracking has been likewise pointed out by them that the majority of cracks are not formed at grain corners. Nield and Quarrel1 meanwhile emphasized the importance of grain boundary migration by designating it as one of two main processes operative in the mechanism of crack formation during creep. The designation seems unnecessary because overemphasis of grain boundary migration only complicates the mechanism of void formation. There are two reasons which militate against the inclusion of grain boundary migration in the mechanism of void formation. In the first place, the formation of intercrystalline voids per se does not require grain boundary migration. Secondly, in addition to grain boundary migration, void formation may be minimized by any other process such as plastic deformation which is capable of relieving localized stresses around jogs. Chang and Grant3 have shown that intercrystalline cracking is prevented in aluminum by lattice bending in high stress regions. The influential role played by grain boundary migration in creep has also been realized in our studies. In several cases, voids did not appear at all in grain boundaries whenever grain boundary migration took place prominently during creep. The purpose of this paper is to discuss the effect of grain boundary migration on the formation of intercrystalline voids and other related rupture properties. Experimental evidence indicates that in an unstable grain structure void formation may be markedly modified by structural changes. The abnormally high ductility and the transcrystalline mode of fracture observed in copper at elevated temperatures reveals that effective grain boundary migration minimizes void formation. Grain boundary migration has long been known as a common high-temperature phenomenon in metals with the grain configuration in a nonequilibrium state. Its effect on ductility and mode of fracture has not been recognized until recently.4 Since the introduction of the term "Equicohesive Temperature," the conventional belief has been that below the equicohesive temperature the ductility of metals increases moderately with decreasing temperature until the ductile-to-brittle transition temperature of fracture is reached. In this temperature range, metals fracture in a ductile mode with a "cup-and-cone" fracture surface. Above the equicohesive temperature, ductility remains invariably low and decreases slightly with increasing temperature. The mode of fracture is strictly brittle and intercrystalline. Typical examples have been shown for a brass and copper in Fig. 1 and 9, respectively, in the paper by Greenwood, Miller, and Suiter.5 The observation in the upper temperature range that ductility of metals is low and insensitive to temperature may be explained in terms of void formation at grain boundaries. It is also in accordance with the findings of McLean6 and Fazen, Sherby, and Dorn7