Institute of Metals Division - The Material Transport Mechanism During Sintering of Copper-Powder Compacts at High Temperatures

The isothermal shrinkage rates of copper-powder compacts were determined in the temperature range from 760o to 1060oC. The rates for compacts fabricated from a pure spherical copper powder were compared, on the one hand, with those fabricated from a spherical powder containing a dispersion of aluminum oxide in the copper matrix and, on the other hand, with those fabricated from a pure copper powder having irregularly shaped particles. The irregular copper-powder compacts shrank much faster than the spherical copper-powder compacts and these, in turn, shrank faster than dispersion -strengthened copper -powder compacts. The experiments were run under a small external load. By varying this load, the stress dependence of the isothermal shrinkage rate could be measured for compacts from spherical-copper powders. This stress dependence was found to be approximately proportional to the 4th (dispersion-strengthened alloys) or 4.5th (pure metals) power of the stress. It is concluded that the material-trans port mechanism is due to dislocation climb rather than to Herring-Naharro creep. In this investigation the isothermal shrinkage rates of compacts made of copper powder with an average particle size of 70 g in the temperature range from 780o to 1060°C were studied. The aim of the investigation was to determine the mechanism of material transport responsible for the shrinkage of these compacts. Since the phenomenon observed in this investigation was shrinkage of compacts at high temperatures, it will be necessary to consider all the material-transport mechanisms possible in sintering. It is unlikely that evaporation and condensation, surface diffusion, or even volume diffusion of vacancies, in which surfaces of small radius of curvature are vacancy sources and those of larger radius of curvature vacancy sinks, will materially contribute to a sintering process involving shrinkage, i.e., one in which the centers of adjacent particles move towards each other. The two principal mechanisms which were considered were the so-called Nabarro-Herring mechanism and a plastic deformation mechanism by dislocation movement. Both of these mechanisms were originally conceived to explain creep, i.e., the plastic deformation of metals at elevated temperatures under a constant applied stress. The shrinking of metal-powder compacts which was studied in this investigation can be readily treated as a creep process. This means that the shrinkage rates observed are considered as creep rates under the influence of an applied stress. It is true that the stresses in sintering experiments are generally not constant but decrease continually with time, but, by considering creep rates or shrinkage rates over a relatively short time interval, the small changes in stress during this time interval can generally be neglected. Nabarro-Herring microcreep is a high-temperature deformation mechanism which is caused by a diffusional flow of vacancies from boundaries under a tensile stress towards those under a compres-sive stress. Herring1 has shown that in this type of microcreep the strain rate e is proportional to the applied stress and follows an equation of the form ma, aexp(-Q/RT) [l| where <j is applied stress, Q is the activation energy for self-diffusion, R is the gas constant, and T is the absolute temperature This type of creep can explain the shrinkage of a porous compact. The surface of the pores are subjected to the tensile stress of surface tension, while the grain boundaries are under a compressive stress also due to surface tension. Vacancies diffuse from the pore surface through the lattice to the grain boundaries, where they are eliminated. In order to maintain vacancy equilibrium at the pore surface the vacancies leaving the region of the pore surface are replenished from the volume of the pore, which means that the pores shrink.