Joining of Inconel 617 Sheets Using TLP Bonding Process With Ni-Si-B Interlayer

Joining of superalloy Inconel 61 7 with a foil interlayer using transient liquid phase bonding (TLP) technique was studied. Inconel 617 is a solid solution, Ni - Cr - Co- Mo alloy with an exceptional composition of high temperature strength, oxidation, carburization resistance and thermal stability. In this investigation, two bonding temperatures, 1065°C and 1150°C, and two interlayer thicknesses with joining times varying from 5 minutes to 24 hours were employed. Experiments were carried out using nickel base interlayer (A WS BNi-3) with boron as the melting point depressant (MPD) element. Joints were characterized using optical microscopy, SEM, FEG-SEM, EBSD, XRD and microhardness. The results indicated that the rate of elimination of the liquid phase with increasing the bonding temperature, holding time and decreasing the thickness of the interlayer increased. The main precipitates in the diffusion layer had platelike and blocky morphologies for both bonding temperatures and all holding times.