Kinetic Transformation of Nanofilamentary Au Metal-Metal Composites

Recovery and recrystallization of Au wire can degrade strength and alter conductivity properties during exposure to elevated temperature. Au Deformation Processed Metal Metal Composites (Au DMMC's) are being developed for electronic applications requiring high conductivity and high strength. This paper discusses the relationships between microstructure, strength, and resistivity of Au DMMC's. It also presents the results of a recent study on the elevated temperature stability of Au DMMC's of several compositions. Au-7 vol %Ag, Au-14 vol %Ag, and Au-vol 7%Pt DMMC samples were prepared by a powder metallurgy technique. All specimens were processed into wire by extrusion, swaging, and drawing. The smallest final diameter of these wires was 120 ?m. Thermal stability was analyzed by electrical resistivity measurements to determine the relation between transformation rates and time at elevated temperature. The extensive deformation used to produce these composites reshaped the initially equi-axed powder into filaments that are 30 to 100 nm in diameter and 16 to 180 mm in length. The small filament diameter confers high strength on the composite. The high conductivity can be explained by electrons flowing parallel to the filamentary microstructure aligned with the wire axis. Using the Avrami and Arrhenius equation relationships, it is possible to predict the times and temperatures needed to achieve various degrees of homogenization. The Au DMMC's were found to have good thermal stability compared to conventional coldworked Au interconnection wires. Although these composites will revert to solid solutions if exposed to high temperatures for prolonged time periods, their relative stability is sufficient to allow them to maintain their twophase microstructure during the anticipated lifetime temperature profiles of many products.