Manufacturing and Mechanical Properties of Ultrafine Grained, Oxide Dispersion Strengthened Copper

Advanced copper materials for conducting applications require an optimal combination of high mechanical strength at ambient and moderately elevated temperatures together with superior electrical and thermal conductivity. Mechanical alloying under repeated cooling of the milling vials in liquid nitrogen has been applied to produce ultra-fine grained (UFG) oxide dispersion strengthened (ODS) copper with a high yield strength at ambient temperature. In the present study ODS copper was manufactured by mechanical alloying of copper powder and 3% by volume of incoherent oxide dispersoids. During the high-energy milling a homogeneous distribution of fine dispersoid particles (diameter nearly 100 nm) can be achieved in the powder. Samples with a density of more then 97% of theoretical value were produced by uniaxial hot pressing under 650 MPa at 600°C for 20 minutes. The high yield strength at ambient temperature can be described by a linear superposition of the Orowan stress for particle hardening and of ultra-fine grain strengthening according to the Hall-Petch mechanism. Simultaneously, a best value of 75% IACS could be obtained for the electrical conductivity. The creep behaviour of ODS copper in the temperature range from 500°C to 700°C is described within the frame of diffusional creep deformation.