Modeling and Measuring Electrodeposition Parameters near Electrode Surfaces to Facilitate Cell Performance Optimization

The short-circuiting tendency of a copper electrowinning cell (EW) based on the roughness of cathode deposits was investigated with varying parameters such as Cu concentration, guar concentration, current density, and temperature. A bench scale EW cell was set up to produce copper under conditions similar to industrial Cu EW. In addition, a statistical analysis and finite element analysis were performed to analyze the deposited thickness, surface roughness and maximum feature height. Interaction data for the cathode deposits suggest that current density and Cu concentration together affect the roughness of deposit more than the combined effect of guar and temperature. Model predictions of roughness were similar to experimental values. The predicted time to short-circuiting was similar to the measured time. This study provides an industrial relevant baseline against which new operating parameters can be compared.