New Anode Compositions For Copper Electrowinning And Copper Electrodeposition At High Current Density

During copper electrowinning in sulphate electrolyte, intense oxygen evolution takes place at the anode. Lead alloy anodes are progressively replaced by dimensionally stable anodes in order to avoid the cathode contamination by dissolved lead. The electroactive coating of these anodes has to be as cheap as possible, adherent to the substrate, electrochemically stable and has to be efficient at high current density and high temperature. This requirement is even demanding in case of copper electrodeposition for the production of thin copper foils for the electronic industry. The production of thin (20 µm thick) copper foils for the printed circuit boards requires high purity copper electrodeposited at a current density as high as 7,000 A/m2. The choice of a long term coating composition is driven by economics. The purpose of this paper is mainly to review the anode compositions suitable for copper electrowinning and for copper electrodeposition at high current density. A short description of preliminary results obtained with a new anode coating on a titanium substrate is also presented.