Optimization of Process Variables During TLP Bonding of Nickel Superalloys

In this study, the kinetics of isothermal solidification during TLP bonding of Inconel 625 and 718 superalloys with nickel based multi-component filler alloy BNi-2 have been studied through a combination of direct experimentation and mathematical modeling in order to determine the effect of process variables and, thus, to optimize the process. The predicted isothermal solidification completion times from the boron diffusion model and migrating solid/liquid interface model were in good agreement with the experimentally determined values and, they were found to be significantly less than those of other nickel superalloys with different nickel based filler alloys. Further, significant reduction of holding time was observed with increasing bonding temperature and with decreasing joint gap. No significant grain growth in the base metals has been observed in the temperature range being investigated (1325 - 1394K).