Optimization of Sputtered Ti/Mo/ Au Metallization System for Solder Bonding

In many electronic/optoelectronic devices, interaction between the metal stack and solder is undesirable. If a reaction happens, a nonuniform joint containing spikes and voids is likely to form and as a result the heat dissipation deteriorates significantly, which in turn, leads to the degradation of the bond. In the present work the interaction between Ti/Mo/ Au metallization system, which was sputter deposited on AlN substrates, and Pb-Sn solder was studied by using scanning electron microscopy (SEM). Also, an EDX system was used to trace the changes in chemical composition of the layers after solder tests. The microstructural examinations show that the Ti and Mo layer from the Ti/Mo/ Au metallization system are not impermeable enough and thus Ca from the surface of the substrate moves all the way up to the interface of Au/Mo and forms an intermetallic at the interface, which grows over time.