Part II – February 1968 - Papers - Bond Degradation Mechanisms in the 75 pct Cu-25 pct Ni/Cu/75 pct Cu-25 pct Ni Coinage Composite

Kirkendall diffusion of copper and nickel atoms across the bond interfaces, as well as oxygen diffusion in the core to the interfaces, are the mechanisms which control the variation in bond strength with annealing time at 1600°to 1800°F in the cupro-nickel clad copper Mint composite. The unequal mass transfer resulting from the high diffusion rate of copper in cupro-nickel compared with that of nickel in copper caused void formation in the core. Small voids also formed in the cladding after short annealing times. These may have been nucleated by nickel oxide particles which are formed by the dissociation of the cuprous oxide in the core and the movement of oxygen to the cupro-nickel interfaces. The bond strength drops to very low values for annealing time up to 3 hr when the void density is greatest. The increase in bond strength after 16 to 72 hr at 1600°F is a result of the decrease in the void density in the cupro-nickel cladding and the growth of grains across the interface. The void density decrease is attributable to grain boundary diffusion of vacancies to the surface. The abnormally large grains in the copper preclude a similar process from taking place in the core. THE solution to many engineering materials problems that cannot be satisfied by using a single metal or alloy is often attained by combining two or more metals in such a way that each component performs a different function, while the composite meets the overall requirements. The Coinage Act of 1965 authorized a changeover from the traditional 90 Ag-10 Cu dimes and quarters to a bimetallic laminate of 75 Cu-25 Ni clad on a copper core. Economic considerations as well as physical, chemical, and mechanical properties provided a basis for the selection of this composite as a substitute for the silver-bearing alloy. An extensive survey of alloys suitable for use as coinage was prepared by Battelle Memorial Institute for the U.S. Mint.1 It was found that the cupro-nickel/cop-per/cupro-nickel composite satisfied the required color, density, mechanical properties, corrosion resistance, electrical properties, and magnetic properties to make it completely acceptable to the general public and the vending machine industry. This investigation is part of a program to determine the feasibility of reclaiming composite scrap by thermally degrading the bond strength of the cupro-nickel clad copper laminate. The composite exhibits bond degradation and subsequent bond improvement during annealing in the temperature range 1600" to 1800°F. A study of the operative diffusion processes and the resultant structural changes was made in order to explain the observed variations in bond strength with annealing time. EXPERIMENTAL PROCEDURES AND RESULTS Bond Degradation. A measurement of the forces required to peel the cupro-nickel cladding from the