Part IV – April 1969 - Communications - Plastic Deformation of Large Copper Whiskers at Different Temperatures and Strain Rates

LARGE copper whiskers were grown from cuprous iodide by reduction with hydrogen at about 500°C. Carefully selected single-crystal whiskers of [loo], [110], and [Ill] orientations were used and the whisker shapes and cross sections are shown in Fig. 1. Spec-trographic analysis of a typical batch of whiskers showed that the composition was better than 99.9 pct with iron and silicon as the major impurities. The test specimens varied from about 70 to 400 u in diam and they did not show a conspicuous yield drop as observed in very fine whiskers (diam <25 u), tested by Brenner.1 The characteristics of the stress-strain curves were similar to those of bulk single crystals, even though the maximum flow stresses reached in some orientations were comparable to the yield stresses observed in fine whiskers. Mechanical properties of whiskers of different materials and copper whiskers up to about 100 u in diam have been reviewed,&apos; and a mechanism of slip band propagation in fine whiskers has been recently suggested.3 Whiskers in this work were tested in a floor-model Instron testing machine using low strain rates. (Details of the testing procedure, diameter dependence of the yield stress, and the characteristics of the load elongation and stress-strain curves have appeared esewhere.4) Due to the extensive deformation, >50