Part IX – September 1968 - Papers - Creep Study on High-Purity Polycrystalline Beryllium

A study uras made on the creep behavior of cast and extruded SR grade beryllium. It is shown that, for stresses below about 1000 psi in the temperature range 760" to 85o° c, the creep behatior is nearly exactly described by the Nabarro-Herring mechanism. The activation energy is apparently that for self-diffusion, 42 2 kcal per mole, below 1000 psi, but it rises to 88.6' kcal per mole at higher stresses. The slress exponent is 4.5 at the higher stresses. Tertiary creep in this material is clearly related to void formation apparently caused by grain boundary sliding. BERYLLIUM is becoming an increasingly important technological material. A search of the literature has revealed a lack of fundamental studies on the creep of beryllium. This investigation was therefore undertaken to gain insight into the creep behavior of this material. EXPERIMENTAL PROCEDURE Tensile creep samples were prepared from cast and extruded SR grade beryllium. The vendor's chemical analysis of the beryllium tested is shown in Table I. The test specimens were machined as shown in Fig. 1 from i -in.-diam rods. The machined creep specimens were annealed to remove surface damage and to establish a variation in grain size. The heat treatments and their resulting grain diameters are shown in Table 11. The average grain diameters were determined by the intercept method. True average grain diameters were estimated by multiplying the measured average grain diameters by 1.5.' The creep tests were performed at temperatures from 700" to 850°C in a vacuum of 105 Torr or better in a tantalum-element resistance furnace. Loads were applied by an Instron testing machine such that the stress was held constant to within 20 psi. The test temperature was measured by thermocouples on the sample. With one exception the deviation from the desired test temperature was 2"C, and in that case the deviation was 4"C. Elongations were measured by an extensometer within the vacuum chamber which was fastened to the creep specimens at the grooves in the grip ends, as shown in Fig. 1. The precision of measurement of elongation was 1 X loe4 in. The creep tests were begun only after thermal equilibrium had been established in the sample and the extensometer to insure that there was no strain rate component due to transient thermal effects. Two kinds of creep experiments were performed. First, at constant grain size, the effects of varying stress and temperature were studied. In the second set of experiments, the temperature was held constant and the grain size was varied. The activation energy for creep was determined by varying the temperature at constant stress, as described by orn, during the first set of experiments. The variable grain size experiments revealed that creep at low stress apparently occurred by the abarro-errin' mechanism. In all of the creep tests, the stress was held constant only until sufficient strain had occurred to accurately determine the creep rate. The stress was then raised to a new value and the new creep rate determined. This process was reported until tertiary creep occurred. In this manner several data points were obtained from each specimen. The assumption was made that the structure was not changing appreciably between the incremental stress levels. This was verified by reducing stresses to previously tested levels and comparing the creep rates with the creep rates obtained at the lower strains. The re-producibility was within experimental error over strains on the order of 1 pct. EXPERIMENTAL RESULTS A typical series of creep tests is shown in Fig. 2. Primary creep was not observed in any test. Transient creep, which we define as creep rates that are nonlinear with time, was not observed for any change in stress except where tertiary creep occurred. The absence of both primary and transient creep has been previously reported for hot-pressed powder beryllium.= The data for the creep behavior at constant grain size are summarized in Fig. 3. The data show two distinctly different stress dependencies. At stresses below about 1000 psi, in the equation: