Part IX – September 1969 – Communications - Grain Boundary Morphologies in Zinc

INTEREST is currently being directed toward grain boundary morphologies in zinc in terms of grain boundary facetingl and grain boundary energies.' Some years ago the present author attempted to measure grain boundary energies in 99.999 pct purity Zn as a function of boundary angle, using the standard procedure of measuring equilibrium angles of the boundary traces at triple points. This followed an investigation he carried out on preferential melting of |H (112) Fig. 1—Electron transmission micrograph of a stacking fault, grain boundary intersection in copper. GRAIN BOUNDARY STACKING FAULT Fig. 2—Schematic representation of the intersection of Fig. 1, indicating inclination angles 0 and trace angles $. specimens were prepared by the Bollman technique in an electrolyte of 70 pct methanol, 30 pct HNO3 main-tained at -30°C. The interfacial free energy of the high angle grain boundary and of the stacking fault is assumed to be thermodynamically equivalent to the corresponding in-terfacial tensions. In terms of the true dihedral angles & between the intersecting interfaces, the equilibrium of interfacial tensions in the direction parallel to the stacking fault yields: ysF = -ygb(cos F1+ cos ±cosF2) Here, ysF is the stacking fault free energy and ygb is the grain boundary free energy, assumed equal on both sides of the intersection. Forces acting normal to the grain boundary, of the form ??gb/?F,l are assumed negligible as the grain boundary remains straight for a considerable distance on either side of the intersection. The micrograph of Fig. 1 may actually consist of several closely spaced stacking faults on the same slip plane. The actual point of intersection between the grain boundary and the first stacking fault, and the equilibrium configuration of the intersection, should not be affected by the presence of the other faults, as