PART XII – December 1967 – Communications - The Fatigue Behavior of a Dispersion-Strengthened Metal

RECENT investigations1,2 of the low-cycle fatigue behavior of pure copper under strain cycling conditions have shown that a unique saturation stress level is eventually attained for each value of applied plastic strain amplitude. The dislocation substructure of copper at the saturation stress level is in the form of cells whose diameter decreases with increasing saturation stress level, i.e., plastic strain amplitude. In addition, both the saturation stress level and the cellular substructure are completely reversible. That is, the saturation stress level and accompanying cell size are determined solely by the present conditions of testing and are, therefore, independent of any previous cyclic history. The mechanical and substructural reversibility observed in pure copper, which has a relatively high stacking fault energy, is not observedz for Cu-7.5A1 which has a much lower stacking fault energy. This implies that easy cross slip (wavy slip) is a prerequisite for reversible fatigue behavior. A dispersion of fine, nondeformable particles of a second phase in a metal matrix tends to stabilize substruc- tures introduced by forming operations during subsequent elevated-temperature heat treatments.3 This raises the question as to whether a finely dispersed second phase can induce an element of irre-versibility into the cyclic deformation behavior of a wavy slip material at room temperature, due to partial stabilization of the initially introduced substructure. Since nickel has a higher stacking fault energy than copper,6 pure nickel should be characterized by cyclic reversibility. Therefore, TD-nickel* (Ni-2ThO.r) was