Reaction Product Layer on Chalcopyrite in Cupric Chloride Leaching

The Outotec HydroCopper® process is a novel technology, developed and registered by Outotec Technology Oy, for leaching copper from chalcopyrite using cupric chloride solution. The leaching process is operated at atmospheric pressure in a stirred tank reactor, at temperatures near the boiling point of water and pH values between 1.5 and 2.5. During the leaching of chalcopyrite in cupric chloride solution, a reaction product layer forms on the mineral surface. In the present work, the formation and the composition of the reaction product layer was studied in an environment similar to that of the HydroCopper® process. The effect of the process parameters on the reaction product layer was investigated. Electrochemical measurements, including A.C. impedance spectroscopy and microscopic observations were carried out and an equivalent circuit was used to determine the surface parameters, such as the reaction product layer capacitance and the charge transfer resistance. The results suggest that, at low pH, a passivating sulfur-rich layer forms, whereas at high pH, a more porous iron-rich layer was detected. The values measured can give useful information for optimising the leaching parameters of the HydroCopper® process. Cu2007