Recovery of Copper Nanoparticles from AMD by Cementation with Iron and SDS

In this work, we studied the recovery of copper from AMD by cementation with iron powder. To control the size of copper particles within the nanoscale range, we tested the use of the anionic surfactant sodium dodecyl sulfate (SDS). We tested three concentration levels (0.2, 0.4 and 0.6 M) and temperatures (25, 50 and 75 °C). The activation energy of cementation was also assessed by fitting the experimental data with the Arrhenius equation. Under all investigated conditions, the cementation reaction was found to be a diffusion-controlled process. Without surfactant, the activation energy was 19.9 kJ/mol. In the presence of SDS the activation energy increased up to about 35 kJ/mol. With or without SDS, the particle size of the copper product was strongly affected by the cementation temperature. Without SDS, the cemented product aggregated into micro-sized clusters of about 15 μm at 25 °C, 2–3 μm at 50 °C and 1 μm at 75 °C. The addition of SDS resulted in a dramatic decrease of copper particle size up down to the nanoscale range. Under the best operating conditions, the particle size of copper was <100 nm.