Recycle and Reuse of Waste Silicon in Wafer Manufacturing Process

Success of the environmentally benign semiconductor manufacturing depends on the cost-effective integration of the principles of reduce, recover, reuse and recycle from source material to final product disposal. Increasing demand combined with current shortage of polysilicon provided unique opportunities to recover the silicon waste, caused by various defects, in wafer manufacturing process. Current practices relating to recovery and reuse of waste silicon produced, from crystal growth process to finally polished and epitaxially deposited silicon wafer, at Mitsubishi Silicon America is presented. Future plan to recycle the process generated silicon fines produced during the intermediate steps of the wafer manufacturing process such as grinding, slicing, lapping and polishing is also discussed.