Sedimentation characteristics of Cu-Ni mill tailings and thickener size estimation

"This paper describes a study carried out to determine the behaviour of Cu-Ni mill tailings during natural and flocculated sedimentations. Settling rates were examined under various conditions through standard laboratory batch settling tests. Flocculation was found to improve the sedimentation process significantly, but its effectiveness depended on several factors such as the pulp density of feed, the type and dosage of flocculating reagent, the pH of pulp, the intensity of mixing flocculant with tailings sand the use of stirring during compaction.It is shown that. for a sedimentation process taking place under given conditions, underflow pulp density (P) and sedimentation time (t) are related by the expression P = k.tn, where k and n are constants. A procedure is described for the use of this expression in thickener size estimations. IntroductionOften a considerable proportion of the mill feed is disposed as tailing, because the valuable mineral recovered usually forms a small fraction of the ore. Moreover, wet concentration processes result in liquid wastes that are several times more voluminous than the ore itself. Thus the handling and disposal of these wastes become an important cost item in most milling operations. The principal unit process employed in tailing disposal is solid-liquid separation which is traditionally carried out by gravity sedimentation in thickeners or tailing dams. Direct disposal of tailings into tailing dams is common practice where sufficiently large areas of land are available but it frequently becomes more economical or practical to densify the tailings in a thickener beforehand.Successful thickener operation depends essentially on correct thickener size which is in turn governed by the sedimentation characteristics of the tailings handled. Flocculation can aid the sedimentation process and bring about significant savings in thickener size, but its effective use requires a detailed study to identify the optimum conditions of application."