Surface Tension Of Acidic Copper Sulfate Solution Simulating Electrolytic Solution For Copper Electrolysis WithlWithout Addition Of Gelatin (Invited)

Surface tension, density and viscosity coefficient of acidic copper sulfate solutions simulating electrolyte solution for electrolytic production of copper have been measured and are summarized as a function of the solution composition and temperature. Nickel sulfatc is taken to be a representative coexisting sulfate that affects the physical properties of the copper sulfate electrolyte solution. The sulfates in the solutions, including sulfuric acid, increase the physical properties under consideration. Gelatin, representing organic additives for electrolyte solution, was found to sensitively affect the surface tension of the solution at low concentration of up to 200mgIL. The surface tension was markedly lowered by the addition of gelatin and the increasing concentration of gelatin led to a more pronounced decrease in the observed values. The surface tension gradually increases with time after addition of gelatin and the increase is enhanced by higher acid concentration and higher temperature. The observed change in the surface tension is considered to reflect the preferential adsorption of gelatin to the bubble-solution interface and the decomposition of gelatin due to hydrolysis to form various molecules having smaller molecular weights.