Technical Notes - Some Observations on the Rate of Secondary Recrystallization in High Purity Copper

It is well known that if copper that has been severely cold-worked by rolling (70-98 pct) is heated to high temperatures a small number of large grains are formed at the expense of the fine grained structure that appears upon primary recrystallization. Dahl and Pawlek,' Cook and Mac-Quarie,2 Ward,3 and Boas and Bowles4 have studied this phenomenon in copper. It has been reported as taking place with measurable velocities in the temperature range 700-1080". Boas and Bowles have reported that the time necessary for the transformation is of the order of days at 700°C. According to Ward3 the number of secondary grains which appear in OFHC copper decrease with increasing perfection of cubical alignment after primary recrystallization; also the perfection of cubical alignment increases with decreasing grain size prior to the final reduction. In this investigation two heats, A and B, of especially high purity copper (99.999 pct) supplied by the American Smelting and Refining Co., were used. The behavior of samples prepared from the two heats was qualitatively very similar providing that the grain sizes established prior to the final reduction were about the same. We observed that in specimens prepared from bars which were relatively coarse grained prior to final reduction secondary recrystallization took place at a rapid rate at temperatures as low as 500°C. This is about 200-300°C lower than the temperature necessary to obtain fairly rapid transformation in OFHC copper. A 0.22 in. thick rectangular bar of lot B was cold-reduced 60 pct by straight rolling and given a penultimate annealing treatment at 250°C. Following this it was cold-reduced 90 pct and heated to various temperatures in the range 450-1040°C. The specimens were about 8 mils thick