The Analysis of CVD Operations in the Presence and Absence of Plasma Enhancement

"A mathematical formulation has been presented to describe heat and fluid flow phenomena in CVD operations. In the statement of the problem, which included consideration of plasma enhanced CVD systems, emphasis was placed on identifying the parameters which play a key role in determining the rate and the spatial uniformity of the deposition process. This was done both through the appropriate dimensionless groups and by presenting an extensive set of computed results. The main conclusions that may be drawn from this work are that the deposition rate will be inherently non-uniform for atmospheric CVD systems; this may be somewhat ameliorated by inclining the susceptor or changing the vessel contours. Operation at greatly redeced pressures and for PECVD systems will give a much more spatially uniform deposition rate.1. INTRODUCTIONIn recent years, there has been a growing interest in chemical vapor deposition techniques for the preparation of thin films for semiconductor, photovoltaic applications and for coatings in general, as evidenced by numerous journal articles and symposium proceedings devoted to this topic (1-6). An interesting variant of this technique is to perform the deposition in a plasma or glow discharge at low pressures because this technology obviates the need for the thermal decomposition of the precursor at the substrate surface and permits operation at greatly reduced temperatures (7-10).By far, the largest portion of the reported work dealing with both these aspects of the technology has been concerned with the characterization of the deposit, quite properly so. However, in more recent times it has been realized that the transport aspects of these processes are also deserving of attention because the understanding of heat flow, fluid flow and diffusional phenomena may provide the key to the solution of problems associated with obtaining uniform deposits and the proper scaling of laboratory measurements in order to design industrial CVD systems."