The Behaviour of Copper during the Dissolution of Metallic Nickel in Cuso4 Solutions

The equilibrium of the CuO-Cu20-Cu+-Cu2+ system with various chloride ion concentrations in solution in the presence or absence of an oxidant was investigated. It is shown, that, regardless of the presence or absence of chloride ions or oxidant (oxygen) in the system, the process can be divided into three stages, which are characterized by differing rates and mechanisms of metallic copper cementation and cuprite precipitation and, hence, lead to differing rates of the dissolution of nickel into solution. The effect of the concentrations of chloride ion and oxidant on the phases in the process residues is also discussed. The addition of an oxidant increases the amount of cuprite (Cu20) in the leach residue. With increasing chloride ion concentrations, the rate of copper cementation increases, even without an oxidant in solution. The results of these laboratory experiments and the mechanisms developed are consistent with analysis of samples of industrial cement copper obtained from the Severonickel Combine.