The Use of the CollaMa® - System for Measuring Glue Activity in Copper Electrolyte in the Laboratory and in the Production Plant

At Norddeutsche AfFmerie the CollaMat is an important instrument for controlling the activity of glue in copper electrolyte. Thanks to on-line measuring of the glue activity appropriate action can to taken in the event of sudden changes, such as an intemption in the glue supply, as well as long-term trends, such as continuously decreasing glue activity over days or weeks. Laboratory tests on the dependence of glue degradation on temperature have shown that relatively small increases in temperature of only 3OC cause the half change value of the glue degradation to reduce by 25 %. It is a similar picture with the sulphuric acid concentration in electrolyte. An increase in the acid concentration from 160 g/l to 200 g/l can - depending on the temperature - likewise result in a decrease in the half change value of up to 25 %.