Transient Liquid Phase Bonding of a Nickel Base Superalloy: Effects of Process Variables

Transient Liquid Phase Bonding (TLP) of a Nickel base superalloy, Inconel 738, was performed to study the influence of holding time, filler gap size, and temperature on the joint microstructure. Insufficient holding time for complete isothermal solidification of liquated insert caused formation of eutectic-type microconstituents along the joint centerline region. An increase in the eutectic thickness with increase in initial filler gap size was observed in joints prepared at a constant temperature and holding time. In agreement with prediction by conventional TLP diffusion models, an increase in bonding temperature for a constant gap size, resulted in decrease in the time, tf, required to form a eutectic-free joint by complete isothermal solidification. However, a significant deviation from these models was observed in specimens bonded at and above l 175°C. A reduction in isothermal solidification rate with increased temperature was observed in these specimens, such that a eutectic-free joint could not be achieved by holding for a time period that produced complete isothermal solidification at lower temperatures. Considerable enrichment of the liquated insert with base metal alloying elements at higher temperatures is suggested to be an important factor contributing to the observed departure from conventional TLP prediction.